Sputtering is a process which includes the emission of atoms,
ions or molecular fragments from a solid material, bombarded with a beam
of energetic particles (generally ions). Ions collide with the surface
of the target, causing the emission of atoms and molecular fragments.
Practical Applications
Sputtering is a process which has several practical applications, typically in the industrial sector (manufacturing of semiconductors), and also in scientific research (solid-state physics, materials science etc.).
SIMS analysis
The sputtering process is also used as the basis of a technique known as secondary ion mass spectrometry (SIMS). It is a very sophisticated technique of chemical analysis of samples, widely used in industrial research.
The two main industrial applications of sputtering are as follows:
Cleaning spray - the gradual erosion of the target can be used to clean the surface of surface contaminants. Alternatively, with the use of appropriate masks placed over the target, the technique can be used to selectively erode some areas of interest.
Sputter Deposition - it is a process through which thin films are deposited in a material with the help of sputtering. This process can be used to cover artifacts in order to protect them. The method is also used in the manufacture of Integrated Circuits.
The deposition by sputtering falls in the collection of techniques grouped under the name of physical vapor deposition.
Sputtering techniques can be substantially divided into three categories:
Magnetron sputtering - this deposition system makes use of a passive device capable of generating a magnetic field. Generally for this purpose NdFeB magnets are inserted below the target. In this way the particles and the electrically charged ions that are subjected to the Lorentz force are diverted by the particular configuration of the field lines, and get more confined in the vicinity of the target, greatly increasing the yield of the process.
RF sputtering - it generally refers to a sputtering technique which is activated by a RF (Radio Frequency). This technique is used for the deposition of insulating materials as this technique allows dispersing the charge that gets accumulated inside the target. The variation of the electromagnetic field provides the energy needed to disperse the accumulated charge.
DC sputtering - it is a variant of the traditional sputtering in which a high DC voltage (Direct Current) is maintained between the target which is to be coated, and the material it is supposed to be coated with. This method allows coating thin metallic layers on substances which are made of highly sensitive surfaces.
Practical Applications
Sputtering is a process which has several practical applications, typically in the industrial sector (manufacturing of semiconductors), and also in scientific research (solid-state physics, materials science etc.).
SIMS analysis
The sputtering process is also used as the basis of a technique known as secondary ion mass spectrometry (SIMS). It is a very sophisticated technique of chemical analysis of samples, widely used in industrial research.
The two main industrial applications of sputtering are as follows:
Cleaning spray - the gradual erosion of the target can be used to clean the surface of surface contaminants. Alternatively, with the use of appropriate masks placed over the target, the technique can be used to selectively erode some areas of interest.
Sputter Deposition - it is a process through which thin films are deposited in a material with the help of sputtering. This process can be used to cover artifacts in order to protect them. The method is also used in the manufacture of Integrated Circuits.
The deposition by sputtering falls in the collection of techniques grouped under the name of physical vapor deposition.
Sputtering techniques can be substantially divided into three categories:
Magnetron sputtering - this deposition system makes use of a passive device capable of generating a magnetic field. Generally for this purpose NdFeB magnets are inserted below the target. In this way the particles and the electrically charged ions that are subjected to the Lorentz force are diverted by the particular configuration of the field lines, and get more confined in the vicinity of the target, greatly increasing the yield of the process.
RF sputtering - it generally refers to a sputtering technique which is activated by a RF (Radio Frequency). This technique is used for the deposition of insulating materials as this technique allows dispersing the charge that gets accumulated inside the target. The variation of the electromagnetic field provides the energy needed to disperse the accumulated charge.
DC sputtering - it is a variant of the traditional sputtering in which a high DC voltage (Direct Current) is maintained between the target which is to be coated, and the material it is supposed to be coated with. This method allows coating thin metallic layers on substances which are made of highly sensitive surfaces.
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